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1. Composition
This kind of product is made of E-fiberglass woven fabric adhered by epoxy resin.
2.. Features
Tg170¡À5¡æ/180¡À5¡æ £¨DSC)
low Z-axis Expansion
High thermal delamination
Lead free compatible,ANTI-CAF
UL Blocking and AOI compatible
3.Applications
Suitable for medium multilayer PCB,used widely in computer.communication equipment,instrumentation,lead-free PCB assembly etc
4.Purchasing Information
Other sheet size and thickness could be available upon request.
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