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Aluminum-based Copper Clad Laminate/AL CCL/Metal base copper clad laminate
1. Composition
This kind of product is made of 1100/1060/3003 / 5052 Alloy, dielectric layer and copper foil adhesive by special resin.
2. Features
---Good heat dissipation
---Good electric insulation
---Good electromagnetic shielding
---High mechanical applications
---Excellent dimensional stability
---V-0 fire-resistance and high electrical breakdown
---Different protective films：normal temperature
medium temperature
High temperature
3.Applications
It is suitable for the thick-film hybrid integrated circuits, LED module, LED backlight TV,LED lighting, high power electronics, IC chip substrates, automobile,motorcycle,electric car appliance , audio, solid state reply solid state voltage regulator module and etc.
4.．Purchasing Information
|
Usual Size |
thickness |
Copper Cladding |
Dielectric layer |
Thermal conductivity |
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500*600mm
500*1200mm
1000*1200mm |
0.6mm
0.8mm
1.0mm
1.2mm
1.5mm
2.0mm
3.0mm |
HOZ
1OZ
2OZ
3OZ
4OZ
6OZ
25μm |
75μm
100μm
120μm
125μm
150μm
200μm |
0.8W/m.K
1.0W/m.K
1.5W/m.K
1.8W/m.K
2.0W/m.K
3.00W/m.K |
5. If you request details properties, please check files in download.
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